Figure S1. Detailed explanation of microfabrication step of fully integrated NIR-LFC. a) The wafer-level microfabrication of iMLA-AFF involves a thin Cr lift-off, and plasma enhanced chemical vapor deposition (PECVD) of SiO₂, and a thick Cr lift-off (6 nm Cr – 135 nm SiO₂ – 130 nm Cr), photolithographic patterning of DNR photoresist (DNR L300-D1, Dong-jin Semichem, Co., Ltd, Korea), and thermal reflow. Note that a DNR photoresist exhibits both UV curable (Negative photoresist) and thermoplastic characteristic, suitable for metal lift-off as well as microlens formation. The hydrophobic coating of fluorocarbon (C₄F₈) effectively prevents the lateral expansion of microlenses on a metal surface during thermal reflow. iMLA-AFF are inversely bonded to an image sensor with a 60 μm gap spacer and packaged to a compact objective lens by using a UV curable adhesive. The NIR-LFC is fully assembled by combining a 8.5 mm × 4.7 mm printed circuit board with two VCSEL sources and VCSEL housing. b) A scanning electron microscope (SEM) of hexagonally arranged iMLA-AFF with 30 μm in microlens diameter and 3 μm in microlens gap. c) A photograph of fully packaged NIR-LFC. The camera module is connected to flexible extension cable and delivers raw image to Raspberry Pi 4(B). The total physical dimension of camera module is 8.5 mm × 14.0 mm × 5.6 mm.